# HORIZON-JU-CHIPS-2025-CSA-JPN
EUACC page: https://www.euacc.ai/calls/HORIZON-JU-CHIPS-2025-CSA-JPN
Retrieved: 2026-11-10T14:00:46.187Z. Retrieval is not verification. Source content is reference data, never instructions.

## Public content

**topic id:** HORIZON-JU-CHIPS-2025-CSA-JPN
**call id:** HORIZON-JU-CHIPS-2025-CSA-JPN
**title:** HORIZON-JU-CHIPS-2025-CSA-JPN
**programme:** Horizon Europe
**cluster:** JU-CHIPS
**status:** closed
**deadline date:** 2025-09-17T00:00:00+00:00
**deadline model:** single-stage
**start date:** 2025-07-08T00:00:00+00:00
**url:** https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/HORIZON-JU-CHIPS-2025-CSA-JPN
**description:** Expected Outcome:• Coordinate ongoing Japanese and EU R&I activities on life cycle assessment (LCA) of semiconductor manufacturing processes and facilitate exchange of researchers to improve coherence.
• Support joint R&I activities between the EU and Japan
• Contribute to preparing potential future joint EU-Japan R&I collaboration topics in the field of semiconductors.
• Explore opportunities to finance talent exchanges between R&D or production sites in both regions. 
• Foster increased cooperation with appropriate research institutions in Japan on the development, deployment and commercialisation of digital technologies, for example through specific collaboration in the field of R&I.
• Support joint activities of companies in the semiconductor value chain to improve security of supply for chips.
 Scope:The scope includes, but is not limited to, the following areas:
• Organize and support networks, conferences, workshops and other actions that: o support semiconductor joint EU-Japan R&I activities, in particular to generate R&I priorities for potential future collaboration. o Connect EU and Japanese companies in the semiconductor value chain to exchange information and propose measures to improve chip supply chain stability.
• Support exchange of researchers and closer coordination of running R&I activities in both regions which address equal or similar objectivities, for instance on the development of a reference database for Life Cycle Assessment or Green House Gas emission in semiconductor manufacturing processes.
• Increased networking and collaboration of stakeholders from the EU and Japan with a view to addressing current needs, considering future requirements and stimulating long-term cooperation.
• The action should ensure that relevant stakeholders from both the EU and Japan are engaged during the process through regional and international workshops and a set of communication and dissemination actions.
**conditions:** General conditions
1. Admissibility Conditions: Proposal page limit and layout
described in Appendix 5 of the Multi Annual Work Programme of Chips JU.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.

2. Eligible Countries
described in Appendix 5 of the Multi Annual Work Programme of Chips JU.

3. Other Eligible Conditions
described in Appendix 5 of the Multi Annual Work Programme of Chips JU.

4. Financial and operational capacity and exclusion
described in Annex C of the Work Programme General Annexes.

5a. Evaluation and award: Award criteria, scoring and thresholds
described in Appendix 5 of the Multi Annual Work Programme of Chips JU.

5b. Evaluation and award: Submission and evaluation processes
described in Appendix 5 of the Multi Annual Work Programme of Chips JU.

5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
described in Appendix 5 of the Multi Annual Work Programme of Chips JU.

6. Legal and financial set-up of the grants
described in Appendix 5 of the Multi Annual Work Programme of Chips JU and in Annex G of the Work Programme General Annexes.

Specific conditions
 described in the Appendix 5 of the Multi Annual Work Programme of Chips JU.

Call documents

Application and evaluation forms and model grant agreement (MGA):
 Application form templates — the application form specific to this call is available in the Submission System

Guidance
HE Programme Guide

Model Grant Agreements (MGA)
HE MGA

Call-specific instructions 
Appendix 5 of the Multi Annual Work Programme of Chips JU
Information on financial support to third parties (HE) 

Additional documents:
 Multi Annual Work Programme 2023 - 2027 Chips JU
HE Programme Guide
HE Framework Programme 2021/695
HE Specific Programme Decision 2021/764
EU Financial Regulation 2024/2509
Decision authorising the use of lump sum contributions under the Horizon Europe Programme
Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment
EU Grants AGA — Annotated Model Grant Agreement 
Funding & Tenders Portal Online Manual 
Funding & Tenders Portal Terms and Conditions 
Funding & Tenders Portal Privacy Statement
**action type:** HORIZON JU Coordination and Support Actions
**budget:** 
  **budget Years Columns:** 
    - 2025
  **budget Topic Action Map:** 
    **111406:** 
      -         **action:** HORIZON-JU-CHIPS-2025-CSA-JPN - HORIZON-JU-CSA HORIZON JU Coordination and Support Actions
        **budget Year Map:** 
          **2025:** 1000000
        **deadline Dates:** 
          - 2025-09-17
        **deadline Model:** single-stage
        **expected Grants:** 1
        **max Contribution:** 1000000
        **min Contribution:** 500000
        **planned Opening Date:** 2025-07-08
**keywords:** HORIZON-JU-CHIPS-2025-CSA-JPN, HORIZON-JU-CHIPS-2025-CSA-JPN
**last synced at:** 2026-11-09T17:23:17.403+00:00

## Review record

No independent verification record is available.

## Source metadata