Digital EuropeDIGITAL JU Simple Grants

International collaboration EU and Japan on semiconductors

Deadline24 September 2026
Total budget€5M
Grant size€3M–€5M
Expected grants2
Opens7 July 2026
Deadline modelsingle-stage
Call IDDIGITAL-JU-CHIPS-2026-SG-JAPAN

What this call funds

Expected Outcome

Projects are expected to contribute to the following expected outcomes:

  • Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
  • Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem

Expected outcomes should have direct and immediate impact on European industry.

Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

Eligibility & conditions+

Conditions

1. Admissibility conditions: Proposal page limit and layout

described in Appendix 8 of Work Programme - Chips for Europe Initiative call document.

Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.

2. Eligible countries

described in Appendix 8 of Work Programme - Chips for Europe Initiative.

3. Other eligibility conditions

Appendix 8 of Work Programme - Chips for Europe Initiative.

4. Financial and operational capacity and exclusion

described Appendix 8 of Work Programme - Chips for Europe Initiative.

5a. Evaluation and award: Submission and evaluation processes

described Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual.

5b. Evaluation and award: Award criteria, scoring and thresholds

described Appendix 8 of Work Programme - Chips for Europe Initiative.

5c. Evaluation and award: Indicative timeline for evaluation and grant agreement

described in Appendix 8 of Work Programme - Chips for Europe Initiative.

6. Legal and financial set-up of the grants

described Appendix 8 of Work Programme - Chips for Europe Initiative.

Call Details

Call document and annexes:

Model Grant Agreements (MGA)

DEP MGA

Additional documents:

DEP Regulation 2021/964

EU Financial Regulation 2024/2509

EU Grants AGA — Annotated Model Grant Agreement

Funding & Tenders Portal Online Manual

Funding & Tenders Portal Terms and Conditions

Funding & Tenders Portal Privacy Statement

Source: EU Funding & Tenders Portal · synced 2026-07-07