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This round is closed. Synced from the EU Funding & Tenders Portal on 9 November 2026.
Based on projects the EU funded on the same subject in this programme.
SCALE-AEMSupply Chain & Automated production Line Expansion for AEM electrolysers
HORIZON-JU-CLEANH2-2025-01-03 · 2026 · Official record ↗
SSUCHY-NextDeveloping the supply chains for industrial hemp fibre and bio-based resins towards high performance circular bio-based composites
HORIZON-JU-CBE-2023-IA-07 · 2024 · Official record ↗
CIRESCritical Infrastructure Resilience through Edge computing Systems
HORIZON-JU-CHIPS-2025-RIA-two-stage · 2026 · Official record ↗
MixMattersSmart and flexible Separation and Valorisation of mixed bio-waste from along the agri-food value chain.
HORIZON-JU-CBE-2022-IA-04 · 2023 · Official record ↗
RENEWCHEMFirst of a kind industrial facility for bio-based long-chain alcohols
HORIZON-JU-CBE-2025-IAFlag-02 · 2026 · Official record ↗
BRILIANCooperative business models for bio-based chains in rural areas
HORIZON-JU-CBE-2022-IA-02 · 2023 · Official record ↗
XTRUST-6GExtended zero-trust and intelligent security for resilient and quantum-safe 6G networks and services
HORIZON-JU-SNS-2024-STREAM-B-01-04 · 2025 · Official record ↗
SingleTreeOptimizing multifunctional forest-based value chains with single tree information and application of digital technologies
HORIZON-JU-CBE-2023-R-02 · 2024 · Official record ↗
Each one links to its EU funding record and the partners it works with: a starting list for building a consortium.
The action should establish a supply chain data platform, as a digital twin of the semiconductor supply chain, which should:
The action should support the data gathering from the companies involved.
The action should support a global mapping of the semiconductor value chain, as regards to the capabilities and the products of each main company and its supply chain relationships.
The action should also support conducting stress tests of the supply chain and develop risk analysis of the EU semiconductor supply chain. Finally, the action needs to support issuing early warnings and recommendations for proactive measures to the Commission and Member States to avoid any potential crisis activation according to Article 23 of the Chips Act.
1. Admissibility conditions: Proposal page limit and layout
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.
2. Eligible countries
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
A number of non-EU/non-Associated Countries that are not automatically eligible for funding have made specific provisions for making funding available for their participants in Horizon Europe projects. See the information in the Horizon Europe Programme Guide.
3. Other Eligibility Conditions
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
4. Financial and operational capacity and exclusion
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
5a. Evaluation and award: Award criteria, scoring and thresholds
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
5b. Evaluation and award: Submission and evaluation processes
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
6. Legal and financial set-up of the grants
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 and in the Annex G of the Work Programme General Annexes.
described in the [specific topic of the Work Programme]
Call Details
Application and evaluation forms and model grant agreement (MGA):
Guidance
HE Programme Guide
Model Grant Agreements (MGA)
HE MGA
Call-specific instructions
Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026
Information on financial support to third parties (HE)
Additional documents:
EU Financial Regulation 2024/2509
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
Confirm the current call documents and submission conditions with the funding authority.
View on EU portal ↗Source: EU Funding & Tenders Portal · synced 2026-11-09
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