What this call funds
Expected Outcome
The action should establish a supply chain data platform, as a digital twin of the semiconductor supply chain, which should:
- Gather secure, anonymized data shared by companies, coming from both upstream and downstream industries.
- Possibly make use of an existing digital reference14 of the semiconductor supply chain (based on semantic web technologies).
- Be managed by a trusted intermediary and hosted on a trusted data sharing infrastructure (potentially leveraging secure Multi-Party Computation).
- Provide access to each participating company (providing its data) to its own data and aggregate anonymised data.
The action should support the data gathering from the companies involved.
The action should support a global mapping of the semiconductor value chain, as regards to the capabilities and the products of each main company and its supply chain relationships.
The action should also support conducting stress tests of the supply chain and develop risk analysis of the EU semiconductor supply chain. Finally, the action needs to support issuing early warnings and recommendations for proactive measures to the Commission and Member States to avoid any potential crisis activation according to Article 23 of the Chips Act.
Eligibility & conditions+
General conditions
1. Admissibility conditions: Proposal page limit and layout
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.
2. Eligible countries
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
A number of non-EU/non-Associated Countries that are not automatically eligible for funding have made specific provisions for making funding available for their participants in Horizon Europe projects. See the information in the Horizon Europe Programme Guide.
3. Other Eligibility Conditions
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
4. Financial and operational capacity and exclusion
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
5a. Evaluation and award: Award criteria, scoring and thresholds
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
5b. Evaluation and award: Submission and evaluation processes
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
6. Legal and financial set-up of the grants
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 and in the Annex G of the Work Programme General Annexes.
Specific conditions
described in the [specific topic of the Work Programme]
Call Details
Application and evaluation forms and model grant agreement (MGA):
Guidance
HE Programme Guide
Model Grant Agreements (MGA)
HE MGA
Call-specific instructions
Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026
Information on financial support to third parties (HE)
Additional documents:
EU Financial Regulation 2024/2509
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
Source: EU Funding & Tenders Portal · synced 2026-07-07