What this call funds
Expected Outcome
The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies. The topic would aim to foster collaboration between European and Digital Partnership countries’ R&I communities. Projects are expected to contribute to the following outcomes:
- Innovative design and integration concepts for neuromorphic computing systems supporting very low energy consumption, connectivity, embedded functions for mobile applications.
- Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast-paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint.
- Very advanced packaging solutions aiming heterogeneous integration of multiple functions and materials for applications in communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration.
Eligibility & conditions+
General conditions
1. Admissibility conditions: Proposal page limit and layout
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.
2. Eligible countries
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
A number of non-EU/non-Associated Countries that are not automatically eligible for funding have made specific provisions for making funding available for their participants in Horizon Europe projects. See the information in the Horizon Europe Programme Guide.
3. Other Eligibility Conditions
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
4. Financial and operational capacity and exclusion
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
5a. Evaluation and award: Award criteria, scoring and thresholds
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
5b. Evaluation and award: Submission and evaluation processes
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026.
6. Legal and financial set-up of the grants
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026 and in the Annex G of the Work Programme General Annexes.
Specific conditions
described in the Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026
Call Details
Application and evaluation forms and model grant agreement (MGA):
Application form templates
Please use the application form that you will find in the Submission System. You can find examples of standard application forms in the Reference Documents page.
Guidance
HE Programme Guide
Model Grant Agreements (MGA)
HE MGA
Call-specific instructions
Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026
Information on financial support to third parties (HE)
Additional documents:
EU Financial Regulation 2024/2509
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
Source: EU Funding & Tenders Portal · synced 2026-07-07