What this call funds
Expected Outcome
Proposals submitted to this call are expected to address several of the following elements:
- Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes.
- Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration.
- Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches.
- Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks.
- Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.
Eligibility & conditions+
General conditions
1. Admissibility conditions: Proposal page limit and layout
Proposal page limits and layout: detailed in Part B of the Application Form, which you can access from the Call documents section on the Chips JU website's Call page
The following information are all described in the Appendix 7 of the Chips JU Workprogramme
2. Eligible countries
3. Other Eligibility Conditions
4. Financial and operational capacity and exclusion
5a. Evaluation and award: Award criteria, scoring and thresholds
5b. Evaluation and award: Submission and evaluation processes
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
6. Legal and financial set-up of the grants
Specific conditions
Please visit the Chips JU website's Call page
Please refer to the calls documents section on the Chips JU website's Call page to view and download all required documents and templates.
Specific Call Documents
2026 Guide for Applicants RIA_IA_FT-FPP
Evaluation Form Chips IA RIA FT-FPP
Template Application form Part B IA-RIA-FT FPP
Ownership Control Declaration form template
National Budgets Table template (xls)
General Call Documents
Chips JU Multiannual Work Programme
Appendix 7 to the Work Programme - Electronic Components and Systems (ECS) - 2026
PAB decision on the evaluation and selection procedures related to Calls for Proposals
ECS Strategic Research and Innovation Agenda
Rules for legal entity validation, LEAR appointment, financial capacity and ownership control assessment
Annotated Model Grant Agreement for EU Funding Programmes 2021-2027
Application and evaluation forms and model grant agreement (MGA):
Model Grant Agreements (MGA)
HE MGA
Call-specific instructions
Information on financial support to third parties (HE)
Information on clinical studies (HE)
Additional documents:
EU Financial Regulation 2024/2509
EU Grants AGA — Annotated Model Grant Agreement
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
Source: EU Funding & Tenders Portal · synced 2026-07-07