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This round is closed. The next round and similar open calls are listed below. Synced from the EU Funding & Tenders Portal on 9 November 2026.
This call is closed. These open or upcoming calls fund the closest work.
Based on projects the EU funded on the same subject in this programme.
AISHAArtificial Intelligence Skills Hub Academy
DIGITAL-2025-SKILLS-08-GENAI-ACADEMY-STEP · 2026 · Official record ↗
EDIH-SNLEuropean Digital Innovation Hub South Netherlands
DIGITAL-2021-EDIH-INITIAL-01 · 2023 · Official record ↗
EDIH RheinlandEuropean Digital Innovation Hub Rheinland
DIGITAL-2021-EDIH-INITIAL-01 · 2023 · Official record ↗
CASTIEL 3Coordination and Support for National Competence Centres on a European Level, Phase 3
DIGITAL-JU-EUROHPC-2025-NCC-01-02 · 2026 · Official record ↗
MERITMaster of Science in Smart, Secure and Interconnected Systems
DIGITAL-2021-SKILLS-01-SPECIALISED · 2022 · Official record ↗
EDIH-EBEEuropean Digital Innovation Hub - Energy in the Built Environment
DIGITAL-2021-EDIH-INITIAL-01 · 2022 · Official record ↗
AI-ShiftLabsAI-Swedish network for Sustainable AI, Digitalisation and Human- Centric Factory Transformation
DIGITAL-2025-EDIH-EU-EEA-08-CONSOLIDATION-STEP · 2026 · Official record ↗
INFAB HUBConsolidation of the services and activities deployed by INFAB HUB.
DIGITAL-2025-EDIH-EU-EEA-08-CONSOLIDATION-STEP · 2026 · Official record ↗
Each one links to its EU funding record and the partners it works with: a starting list for building a consortium.
Expected outcomes: A sustained pipeline of highly qualified semiconductor graduates, with shorter time-to-readiness for industry roles; greater inflow of diverse talent including women and underrepresented groups; improved intra- and extra-EU student mobility; and strong complementarity with existing Chips Act infrastructure such as pilot lines, design platforms, and Competence Centres.
This call funds the creation of specialised academic "Hubs of Excellence" in critical semiconductor technology areas (e.g. chip design, manufacturing, photonics, power electronics). Projects should build industry-aligned Bachelor, Master, and PhD programmes.
1. Admissibility conditions: Proposal page limit and layout
The proposal page limits and layout is described in Part B of the Application Form, which can be accessed on the Chips JU website's Call page
The following information are all described in the Appendix 8 of Work Programme - Chips for Europe Initiative :
2. Eligible countries
3. Other eligibility conditions
4. Financial and operational capacity and exclusion
5a. Evaluation and award: Submission and evaluation processes
5b. Evaluation and award: Award criteria, scoring and thresholds
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
6. Legal and financial set-up of the grants
Call document and annexes:
The Call Documents Section contains all the call documents, as follows:
Application form template Part B
Guide for Applicants
Evaluation form
Ownership Control Declaration
National Budget table
Additional documents:
DEP MGA
DEP Regulation 2021/964
EU Financial Regulation 2024/2509
Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment
EU Grants AGA — Annotated Model Grant Agreement
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
Confirm the current call documents and submission conditions with the funding authority.
View on EU portal ↗Source: EU Funding & Tenders Portal · synced 2026-11-09
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