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This round is closed. Synced from the EU Funding & Tenders Portal on 9 November 2026.
Based on projects the EU funded on the same subject in this programme.
EMPOWERUptake of new generation AI Powered Investigative tools for LEAs
DIGITAL-2022-DEPLOY-02-LAW-SECURITY-AI · 2023 · Official record ↗
EUNOMIA.AIEUNOMIA.AI
DIGITAL-2025-AI-08-SUPPLY-AI · 2026 · Official record ↗
aCCCessalliance of Chips Competence Centers for enhanced semiconductor services
DIGITAL-Chips-2024-CSA-CCC-2 · 2025 · Official record ↗
INSIEMEIntegrated Network for data Space and Interoperable Energy Management in Europe
DIGITAL-2024-CLOUD-AI-06-ENERSPACE · 2025 · Official record ↗
GenAISpaceMaking AI-Ready Manufacturing Data Available to Train Generative AI Models via a Data Space Marketplace
DIGITAL-2026-DSM-AI-09-DS-MANUFACTUR-STEP · 2026 · Official record ↗
BUILDBestUse In Local Digital twins towards the CitiVERSE
DIGITAL-2024-BESTUSE-07-MULTICOUNTRY · 2025 · Official record ↗
AENAONEx-Ante cybersecurity Federated Digital twin-based Cyber Range and managed security services for offshore wind farms
DIGITAL-ECCC-2024-DEPLOY-CYBER-07-LARGEOPER · 2026 · Official record ↗
LDT4SSCLocal Digital Twins for Smart and Sustainable Communities
DIGITAL-2024-CLOUD-DATA-AI-07-DIGITALTWIN · 2025 · Official record ↗
Each one links to its EU funding record and the partners it works with: a starting list for building a consortium.
Europe's first long-term VET provider network for semiconductors; a larger and more diverse pool of qualified technicians; and increased intra- and extra-EU mobility of students and workers to fill skills gaps in semiconductor facilities.
This call supports the establishment of a European-level federation of Vocational Education and Training (VET) providers focused on semiconductor industry roles. Projects should develop industry-aligned micro-credentials and reskilling programmes, with a strong emphasis on workers transitioning from other industrial sectors and on cross-border recognition of qualifications.
1. Admissibility conditions: Proposal page limit and layout
The roposal page limits and layout is described in Part B of the Application Form, which can be accessed on the Chips JU website's Call page
The following information are all described in the Appendix 8 of Work Programme - Chips for Europe Initiative :
2. Eligible countries
3. Other eligibility conditions
4. Financial and operational capacity and exclusion
5a. Evaluation and award: Submission and evaluation processes
5b. Evaluation and award: Award criteria, scoring and thresholds
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
6. Legal and financial set-up of the grants
Call document and annexes:
The Call Documents Section contains all the call documents, as follows:
Application form template Part B
Guide for Applicants
Evaluation form
Ownership Control Declaration
National Budget table
Additional documents:
DEP MGA
DEP Regulation 2021/964
EU Financial Regulation 2024/2509
Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment
EU Grants AGA — Annotated Model Grant Agreement
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
Confirm the current call documents and submission conditions with the funding authority.
View on EU portal ↗Source: EU Funding & Tenders Portal · synced 2026-11-09
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