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This round is closed. Synced from the EU Funding & Tenders Portal on 9 November 2026.
Practical chip design experience integrated into education at multiple levels; at least 1,000 students across Europe completing funded tape-outs over 4 years; stronger reskilling pathways for students from adjacent fields; and a sustainable, continent-wide pipeline of chip design talent to support Europe's semiconductor ambitions.
This call funds a comprehensive Chip Design Skills Programme to lower barriers to entry in chip design and tape-outs. At least 60% of the budget must support hands-on tape-out experiences (via multi-project wafers) for university and secondary school students.
1. Admissibility conditions: Proposal page limit and layout
The proposal page limits and layout is described in Part B of the Application Form, which can be accessed on the Chips JU website's Call page
The following information are all described in the Appendix 8 of Work Programme - Chips for Europe Initiative
2. Eligible countries
3. Other eligibility conditions
4. Financial and operational capacity and exclusion
5a. Evaluation and award: Submission and evaluation processes
5b. Evaluation and award: Award criteria, scoring and thresholds
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
6. Legal and financial set-up of the grants
Call document and annexes:
The Call Documents Section contains all the call documents, as follows:
Application form template Part B
Guide for Applicants
Evaluation form
Ownership Control Declaration
Additional documents:
DEP MGA
DEP Regulation 2021/964
EU Financial Regulation 2024/2509
Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment
EU Grants AGA — Annotated Model Grant Agreement
Funding & Tenders Portal Online Manual
Funding & Tenders Portal Terms and Conditions
Funding & Tenders Portal Privacy Statement
Confirm the current call documents and submission conditions with the funding authority.
View on EU portal ↗Source: EU Funding & Tenders Portal · synced 2026-11-09
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