REOPHOTONICS

The semiconductor industry is aiming at producing smaller and more powerful chips. However, semiconductor packaging (back-end) technologies have reached their limits in terms of material deposition. Backend solutions for material deposition are 1) Subtractive technologies - etching and electroplating - highly polluting and, thus, unsustainable: and 2) Additive Manufacturing techniques that have reached their resolution limit considering the material fillers and/or viscosity, making it impossible to do smaller packaging and thus smaller chips. Our solution is the io600 system. It uses the CLAD (Continuous Laser-Assisted Deposition) technology to deliver high-volume deposition of any material on any kind of substrate, at a high throughput, highest resolution and without employing polluting materials. Io600 is a game changer in the semiconductor backend process with times higher viscosity than inkjet without any risk of clogging; 50% to 100% higher resolution compared to screen printers, jetters and needle dispensers; 35 times faster than dispensing systems; Smaller KOZ means higher packaging density (10% die-density improvement) and 40% lower CAPEX; Less clean room space (80% lower area); does not employ hazardous chemicals and saves 1 m3 of water per m2 in PCB manufacturing. IO600 customers are semiconductor packaging companies. They will benefit from the improved resolution, higher throughput, lower CAPEX and, because it is a not polluting process, the potential for reshoring the back-end process to the US and Europe. Io600 users of the chips built with io600 systems are electronic equipment manufacturers, which will design smaller, more powerful chips, key in electronics. Io600 aligns with EU strategic policies on Green Deal and sustainability, Digital transformation (better chip designs) and the EU Chips Act as allows reshoring of the backend process and bolsters Europe’s competitiveness and resilience in semiconductor technologies.