European Chips Act / Chips Joint Undertaking 2026 — Financement, éligibilité et comment candidater

Next Deadline16 septembre 2026

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Success rateNon publié officiellement ; compétitif (estimé d'un chiffre à ~20 % selon l'appel)

TRL band3–8

2026 budget€300M

On this page · 18 sections→

01Overview
02Is this for you?
03Pilot lines & competence centres
04Success rates
05Eligibility
06Readiness (TRL)
07Funding detail
08How to apply
09Evaluation criteria
10Documents needed
11Budget breakdown
12Deadlines
13After you're funded
14Practical notes
15Who's been funded
16Key features
17Official links
18FAQ

The programme

Overview

L'entreprise commune « Chips » (Chips Joint Undertaking, Chips JU) est le moteur de financement de l'UE pour les semi-conducteurs — les cerveaux présents partout, des voitures aux centres de données en passant par les accélérateurs d'IA. Elle pilote l'« Initiative Chips pour l'Europe », le volet technologique du European Chips Act, qui canalise jusqu'à 3,3 milliards d'euros de fonds européens (1,65 milliard d'euros au titre d'Horizon Europe et 1,65 milliard d'euros au titre du programme pour une Europe numérique) vers la recherche, les lignes pilotes, les outils de conception et les compétences dont l'Europe a besoin pour cesser d'importer la quasi-totalité de ses puces avancées. En tenant compte des contributions nationales équivalentes et des investissements privés, le Chips JU prévoit de mobiliser près de 11 milliards d'euros d'ici 2030. Contrairement à l'EIC, il s'agit ici de R&I collaborative fondée sur des consortiums : vous candidatez avec des partenaires de plusieurs pays, et non en tant que startup isolée. Le modèle de financement est important : le Chips JU est un partenariat cofinancé, et non une subvention Horizon classique, de sorte que la part de l'UE/du Chips JU n'est qu'une contribution minoritaire de cofinancement — environ 20 % des coûts éligibles pour une grande entreprise dans une Action d'innovation, et jusqu'à environ 35 % pour une organisation à but non lucratif — le reste d'un total viable étant assuré par le cofinancement national de votre propre gouvernement. La plupart des appels financent des Actions de recherche et d'innovation (RIA, recherche en amont aux TRL 3-4) ou des Actions d'innovation (IA, travaux proches du marché aux TRL 5-8). Le TRL (Technology Readiness Level) désigne le niveau de maturité technologique, une échelle de 1 à 9 où 1 correspond à une idée de laboratoire et 9 à un produit déployé sur le terrain.

2026 BudgetSixteen calls worth over €300M launched 7 July 2026: Quantum RIAs (2 calls, 17 Sep), Resilience IAs for Power Electronics/Photonics/Health (3 calls, 16–17 Sep), ECS GLOBAL IA/RIA full proposals (2 calls, 17 Sep), Skills Hubs and Pilot Federation (24 Sep), AI Compute, 6G, and further calls also open

Average Grant

Les chiffres donnent à réfléchir, même si le Chips JU ne publie pas de taux de réussite global comme le fait l'EIC.

Fit

Is this for you?

Ce dispositif est conçu pour les organisations menant une R&D sérieuse sur les semi-conducteurs au sein d'une équipe transfrontalière : fabricants de puces et concepteurs fabless, fournisseurs d'équipements et de matériaux pour semi-conducteurs, entreprises de photonique et de matériel quantique, organismes de recherche et de technologie (RTO comme imec, CEA-Leti, Fraunhofer) et universités. Si vous avez une véritable contribution technique à apporter à la filière européenne des puces — packaging avancé, électronique de puissance, intégration photonique, outils de conception de puces, composants quantiques ou formation de la main-d'œuvre — et des partenaires dans plusieurs pays pour la concrétiser, ce dispositif est fait pour vous. Si vous êtes un fondateur isolé en quête de financement non dilutif pour développer un produit unique, regardez ailleurs : l'EIC Accelerator (subvention plus capital pour une seule entreprise) ou le dispositif Transition du Conseil européen de l'innovation conviennent bien mieux. Les fonds du Chips JU sont partagés au sein d'un consortium et liés à un plan de travail collaboratif, et non versés à une seule équipe.

A good fit if

Consortium working on electronic components & systems — chips, photonics, smart systems, embedded software
Mixed line-up: large enterprises + SMEs + research organisations (typical projects run 20–50 partners)
Entity of any size based in one of the 31 Chips JU Participating States (EU members plus Iceland, Israel, Norway, Türkiye)
Lower-TRL research → RIA call; higher-TRL industrial innovation → IA call (your TRL must match the call's)
Comfortable co-investing — the grant covers roughly half your costs, not all of them

Probably not if

Lone startup wanting non-dilutive cash for its own product → EIC Accelerator
Single-country project with no transnational consortium → your national chips/R&D scheme
Building an actual fab or first-of-a-kind facility → Chips Act Pillar 2 (state-aid route via your government), not JU calls
Need 70–100% cost coverage → mainstream Horizon Europe RIA/IA; Chips JU pays 20–35% EU plus a national top-up

The hidden gate: your country must not only be a Participating State — it must have national budget left for that year's call, and you must pass its separate national eligibility rules. Phone your National Funding Authority before writing a word.

Focus areas

Pilot lines & competence centres

Pilot lines (the shared fabs)

Five open-access pilot lines let companies prototype and validate advanced chips without building their own fab. NanoIC at imec (Leuven) pushes sub-2nm logic and is the largest at a combined €2.5bn (€700m EU, €700m national, the rest from ASML and industry partners). APECS, coordinated by Fraunhofer in Germany, handles advanced packaging and chiplets; FAMES (CEA-Leti, France) covers FD-SOI and emerging memory.

Open-access prototyping and small-volume manufacturing on cutting-edge process technology

PIXEurope photonics pilot line

A dedicated pilot line for advanced photonic integrated circuits, coordinated by ICFO in Barcelona with partners across eleven European countries. It offers cutting-edge platforms to move integrated-photonics processes from lab to industrial adoption.

Photonic chip prototyping and process transfer to industry

Wide-Band-Gap (WBG) pilot line

Focused on wide-band-gap semiconductor materials such as silicon carbide and gallium nitride, used in power electronics and radio-frequency applications.

Research and prototyping on SiC and GaN power and RF devices

EU Chips Design Platform

A pan-European, cloud-based design platform coordinated by imec that gives SMEs, start-ups and fabless firms access to commercial EDA tools, IP libraries and a route to the pilot lines. Onboarding first companies 2026–2028.

Subsidised EDA-tool access, IP libraries and route-to-chip for fabless designers

Competence centres network

A network of national Chips Competence Centres established across all 27 EU member states (plus Norway) to give local industry, SMEs and researchers a single front door to skills, design support and pilot-line access.

Local training, expertise and signposting to Chips JU infrastructure

ECS and Global research-and-innovation calls

Annual collaborative calls in Electronic Components and Systems (ECS) fund consortia from low to high technology-readiness via Research and Innovation Actions (RIA) and Innovation Actions (IA). A 'Global' strand opens topics to international cooperation. EU money is matched by participating-state co-funding, so national eligibility rules apply.

Multi-partner R&D consortia in chips and electronic systems, co-funded by member states

The odds

Success rates — the honest picture

Les chiffres donnent à réfléchir, même si le Chips JU ne publie pas de taux de réussite global comme le fait l'EIC. Les appels individuels de 2026 sont financés à hauteur de 10 à 50 millions d'euros chacun, et un seul grand sujet de ligne pilote ou de conception peut absorber l'essentiel du budget d'un appel — de sorte que seule une poignée de consortiums l'emporte par sujet, et la concurrence se concentre sur les grands RTO et les acteurs de premier rang de la puce. De façon réaliste, les taux de sélection se situent entre quelques pour cent et environ 20 % selon l'appel, et le critère est l'excellence technique jugée par des évaluateurs experts, et non la présentation. Le piège le plus important reste le modèle de cofinancement : il ne s'agit PAS d'une subvention européenne quasi intégrale. La contribution de l'UE/du Chips JU n'est qu'une part minoritaire — environ 20 % des coûts pour une grande entreprise dans une Action d'innovation, jusqu'à environ 35 % pour une organisation à but non lucratif — de sorte que le cofinancement national de votre propre gouvernement est essentiel, et non un bonus. Remporter l'évaluation du Chips JU est nécessaire mais non suffisant : vous devez AUSSI obtenir ce cofinancement national, et les budgets nationaux sont plafonnés par pays et peuvent s'épuiser, si bien qu'une proposition techniquement excellente peut tout de même rester sans financement si votre État membre n'a plus de budget. La plupart des refus ne tiennent pas à une mauvaise science ; il s'agit de consortiums trop minces, d'un mauvais positionnement du TRL, ou de partenaires assemblés sans réelle complémentarité. Si vous n'êtes pas déjà intégré à l'écosystème européen de la puce (associations industrielles AENEAS, Inside, EPoSS), le choix réaliste est de rejoindre un consortium existant plutôt que d'en diriger un pour la première fois.

End-to-end success rateNon publié officiellement ; compétitif (estimé d'un chiffre à ~20 % selon l'appel)

Roughly 1 in 5 applications gets funded. A sharp, evidence-backed proposal is what separates the funded from the rejected.

ECS Calls 2024 — submitted vs selected (Chips JU annual report)

Call / topic	Submitted	Selected	Success rate
Global IA (2024-1, bottom-up)	13	5	38%
IA focus topics (RISC-V, SDV)	2	2	100%
Global RIA (2024-2, bottom-up)	22	3	14%
RIA focus topic (greener manufacturing)	1	1	100%
EU–Korea joint RIA (2024-3)	15	4	27%
Total ECS calls 2024	53	15	28%

The JU's own annual report concedes the success rate 'dropped significantly in 2024', blaming smaller budgets for the open bottom-up topics — the focus topics drew one or two bids each and sailed through. Two-stage calls gate hard: only proposals passing the Project Outline may submit a Full Project Proposal, and grant signature comes roughly 8 months after the final deadline.

Who qualifies

Eligibility

1Ouvert aux entités juridiques — entreprises (de toute taille), organismes de recherche et de technologie, universités et organismes publics — établis dans un État membre de l'UE ou dans un pays associé à Horizon Europe.
2La plupart des appels exigent un consortium de partenaires issus de plusieurs pays participants ; il s'agit d'une R&D collaborative transfrontalière plutôt que d'un financement à candidat unique.
3Le Chips JU étant un partenariat cofinancé, la subvention UE/Chips JU ne couvre qu'une part minoritaire (~20-35 % des coûts) ; chaque partenaire doit également satisfaire aux règles d'éligibilité de sa propre autorité nationale et puiser dans le budget de cofinancement national alloué par ce pays pour atteindre un total viable.
4Les Actions de recherche et d'innovation (RIA) financent la recherche en amont aux TRL 3-4 ; les Actions d'innovation (IA) financent le développement proche du marché aux TRL 5-8.
5Les propositions doivent répondre à un sujet d'appel ouvert précis — packaging avancé, électronique de puissance, photonique, santé, puces quantiques, conception de puces, lignes pilotes, centres de compétences ou compétences.
6Toutes les propositions sont soumises via le portail de l'UE « Funding & Tenders » sous l'identifiant d'appel HORIZON-JU-CHIPS (Horizon Europe) ou DIGITAL-JU-CHIPS (Europe numérique) correspondant.

The fine print

Two rulebooks, one proposal — and the national one can sink you

Most 2026 ECS (Electronic Components and Systems) calls are co-funded with National Funding Authorities (NFAs): the Chips JU pays the EU share, your own Participating State pays the national share under its own rules. The work programme carries a country-by-country annex of national eligibility criteria, and several states demand a parallel national application — Austria, for instance, requires Austrian partners to file electronically via the FFG eCall system before the deadline. Winning the European evaluation does not guarantee national money; partners ruled ineligible by their NFA can hole an otherwise funded consortium below the waterline.

Country eligibility is wider than Horizon Europe — on paper

Participation in the 2026 global calls is limited to legal entities established in EU member states (including overseas countries and territories), the EEA (European Economic Area: Iceland, Liechtenstein, Norway), Horizon Europe associated countries, and OECD and Mercosur countries. UK and Swiss entities clear the EU-level test (both are OECD members, and the UK is Horizon-associated). The catch is the money: national co-funding flows only through the NFAs of Chips JU Participating States, so check whether your national authority actually funds this call before budgeting around it.

The 30% cap is an exclusion ground, not a scoring nudge

In the bottom-up global IA (Innovation Action) and RIA (Research and Innovation Action) calls, no single partner may take more than 30% of the total EU funding requested. The work programme is blunt: proposals that do not comply "will be excluded" — they never reach the evaluators. A dominant coordinator who hoovers up the budget disqualifies everyone.

Foreign-control screening under Article 22(5)

An entity established in an eligible country but directly or indirectly controlled from a non-eligible country (or by a non-eligible-country entity) may not participate unless it provides guarantees approved by its member state or associated country of establishment, demonstrating that the project's results, IP (intellectual property) and sensitive information stay out of non-eligible hands. Guarantees are submitted after proposal selection — so a foreign-owned subsidiary can pass evaluation and still fall at grant preparation. Entities assessed as high-risk suppliers of mobile-network equipment (or anything they fully or partially own or control) cannot submit guarantees at all.

Financial capacity is checked for every beneficiary, not just the coordinator

All beneficiaries face a financial-capacity check during grant preparation — balance sheet, profit-and-loss account, audited accounts for the last closed financial year — except public bodies and participants requesting no more than €60,000. A weak balance sheet (the analysis also weighs dependency on EU funding and prior-year deficits) can trigger pre-financing in instalments, bank guarantees, joint-and-several liability, zero pre-financing, forced replacement of the partner, or rejection of the entire proposal. Young, loss-making startups should budget for this conversation.

Entity-type fine print

Natural persons are ineligible (sole traders without separate legal personality excepted). International organisations are out unless they qualify as being "of European interest". EU bodies cannot join the consortium (the Commission's Joint Research Centre excepted). Entities under EU restrictive measures are barred in any capacity — including as subcontractors — as are Hungarian public-interest trusts under the EU's rule-of-law conditionality decision. Every beneficiary and affiliated entity must be registered and validated in the Participant Register before submission.

Technology readiness

Where you need to be

Your project should sit at TRL 3–8 when you apply. The eligible band is highlighted below.

1
Basic principles observedThe underlying science is written up; no application yet.
2
Technology concept formulatedA practical use for the idea is proposed on paper.
3
Experimental proof of conceptLab experiments show the core idea can work.
4
Technology validated in labComponents work together in a controlled lab setup.
5
Technology validated in relevant environmentThe setup is tested in conditions closer to the real world.
6
Technology demonstrated in relevant environmentA full prototype is demonstrated in a realistic setting.
7
System prototype demonstration in operational environmentA pre-production prototype runs in its real operating environment.
8
System complete and qualifiedThe technology is finished and proven through test and qualification.
9
Actual system proven in operational environmentFully commercial, operating at scale in the field.

The money

The money — tripartite co-funding

Combined envelope≈€11bnEU + national + private investment, 2023–2027, across research calls and Chips Act infrastructure

EU rate (ECS calls)20–35%IA: 20% large / 30% SME / 35% other · RIA: 25% / 35% / 35% of eligible costs

National top-up+26–31%average national rate on 2024 selected projects — total public coverage ≈52–62%

2026 ECS call budget~€180MEU side, spread across 10 ECS calls incl. €50M global RIA and €40M global IA

Good to know

Three wallets, two applications.

Chips JU is a tripartite partnership: the EU (through the Joint Undertaking), the Participating States, and the participants themselves. That means you apply twice — once on the EU Funding & Tenders Portal, once to your national funding authority (in Austria via the FFG eCall, in Denmark via e-grant) — and if you win, you sign two separate grant agreements. The proposal even carries a special 'National Budgets Table' and password-protected national annexes per country.

The national-budget trap.

Each country publishes its own pot per topic — Austria's 2025 allocation was €3.0M for the global IA (Innovation Action) topic and €3.6M for the global RIA (Research and Innovation Action) — plus its own rules (Austria demands a 1.5:1 person-month ratio of companies to research organisations; other states require an SME or an academic partner in the consortium). A top EU evaluation score does not conjure national money: if your country's pot is empty or you fail national eligibility, you sit in the project under-funded. In some countries costs only become eligible from the day the national contract is signed.

Rates depend on size, not merit.

On the EU side, a large enterprise gets 20% of costs in an IA and 25% in a RIA; an SME gets 30% and 35%; research organisations and other non-profits get 35%. The national grant adds on average another 26–31%, leaving roughly 40–48% of project costs as your own investment. One exception proved the rule: the 2024 EU–Korea joint call was 100% EU-funded with no national leg.

The portal cannot do the maths.

The Funding & Tenders Portal does not implement Chips JU's bespoke funding rates for large enterprises — applicants must compute their requested EU contribution outside the system and type the figure in manually. After signature, all payments (prefinancing, interim, balance) flow to the coordinator, who redistributes under the consortium agreement.

The process

How to apply — step by step

1
Pick the right call route and build a consortium6-10 weeks to assemble consortium
The Chips Joint Undertaking (Chips JU) runs two distinct funding routes you must choose between before writing anything. The 'Global' Research and Innovation Action (RIA) and Innovation Action (IA) calls (e.g. HORIZON-JU-CHIPS-2026-1-RIA) are funded entirely by the Chips JU. The bi-partite 'ECS' (Electronic Components and Systems) calls layer a Chips JU grant on top of national co-funding from each partner's Participating State (e.g. FFG in Austria, Vinnova in Sweden). Both demand a transnational consortium — typically academia plus industry, with strong business participation for market-oriented IA projects. Use the ECS Brokerage Event and partner-search tools to assemble it.
2
Submit the first-stage short proposal (Project Outline)4-6 weeks to draftpass rate stage-2 cut set to admit ~2-3x available budget
Chips JU calls are two-stage. At stage one you submit a short proposal — a Project Outline (PO) for ECS calls, or the first-stage Part B on the EU Funding & Tenders Portal for Global calls — giving key data, the consortium, and the technical concept against the chosen Multiannual Work Programme challenge/topic. For 2026 the first-stage deadline was 6 May 2026, 17:00 Brussels time. Chips JU-appointed independent experts score it against Excellence and Impact only (Implementation is not yet assessed). Each criterion is scored 0-5 with half-marks; threshold is 3/5.
3
Submit the second-stage Full Project Proposal8-12 weeks to draft
Only consortia that pass the first stage are invited to submit the Full Project Proposal (FPP) — the complete technical description, detailed work packages, costs, and per-partner budgets, submitted via the Funding & Tenders Portal (and the national e-Call for ECS bi-partite calls). The 2026 second-stage submission window opened on 7 July 2026, with a deadline of 17 September 2026. Independent experts now score all three criteria — Excellence, Impact, and Quality and Efficiency of the Implementation — each 0-5 (threshold 3/5), with consensus reports and a ranked list.
4
National co-funding decision (ECS bi-partite calls only)Decision ~early 2027 for 2026 calls
For ECS calls, ranking by Chips JU experts is necessary but not sufficient: each national funding authority of every Participating State makes its own formal co-financing decision for its own beneficiaries, against national rules and budgets. The Chips JU collects these decisions and relays the consolidated result to consortium coordinators. For the 2026 calls this was expected in early 2027. Global RIA/IA calls skip this step — funding comes wholly from the Chips JU.
5
Grant agreement preparation and signatureSeveral months after evaluation
Successful proposals enter Grant Agreement Preparation (GAP) on the Funding & Tenders Portal: legal and financial validation of each beneficiary, finalised budgets, and the description of action. The Chips JU signs the EU grant; for bi-partite ECS projects national authorities additionally contract their own beneficiaries under national agreements. Standard Horizon Europe time-to-grant targets apply.

Evaluation

What evaluators look for

Excellence

Threshold ≥3/5 (scored at both stages)

Scientific and technological soundness and ambition of the concept, the credibility of the proposed approach against the targeted Work Programme challenge/topic, and the appropriateness of the TRL focus (centre of gravity TRL 3-4 for RIA, higher TRL 5-8 for market-oriented IA). Scored 0-5 with half-marks.

Clarity and pertinence of objectives vs the chosen Work Programme challenge
Soundness and credibility of the methodology and concept
Ambition and technological maturity (TRL) relative to the state of the art

Impact

Threshold ≥3/5 (scored at both stages)

Contribution to European semiconductor sovereignty, supply-chain resilience and industrial competitiveness; for IA projects a credible deployment/exploitation plan ensuring economic value creation in Europe and a clear roadmap beyond the project. Scored 0-5 with half-marks.

Expected industrial, economic and societal impacts
Credibility of exploitation/deployment and a roadmap beyond the project horizon
Measures to maximise impact (dissemination, IP, market uptake)

Quality and Efficiency of the Implementation

Threshold ≥3/5 (second stage / Full Project Proposal only)

Coherence of the work plan, allocation of resources and budget, and the quality and complementarity of the consortium (transnational, academia plus industry; significant business participation for IA). Assessed only at the second stage once the full proposal and detailed costs are submitted. Scored 0-5 with half-marks.

Quality and effectiveness of the work plan and work packages
Appropriateness of resource and budget allocation
Capacity, complementarity and balance of the consortium

Paperwork

Documents you'll need

Chips JU — Open and Upcoming CallsWeb

The official hub listing open and planned calls, deadlines, and links into each call's detail page and submission portal — start here to find your topic. (The former /callsinfo/ URL now returns 404; the current page is /Open-and-Upcoming-Calls.)

View document

Multiannual Work Programme 2023-2027 (and yearly appendices)Web + PDF annexes

The strategic and legal basis for all calls — defines the topics, challenges, budgets and TRL focus you must address in your proposal; yearly appendices list the specific activities launched each year.

View document

Global RIA call detail — HORIZON-JU-CHIPS-2026-1-RIAWeb

Call page giving budget (€50M), opening (3 Feb 2026), first-stage deadline (6 May 2026) and second-stage deadline (17 Sep 2026, now open from 7 Jul 2026), grant range and submission portal link.

View document

EU Funding & Tenders Portal — Chips JU RIA two-stage topicWeb

The Commission portal where Global-call proposals are submitted; hosts the call documents, proposal templates (Part A/B), and submission system for both stages.

View document

Guide for Applicants — Chips JU Non-Initiative (ECS) CallsWeb (PDF linked per call)

Step-by-step guidance for the bi-partite ECS route: the Project Outline / Full Project Proposal two-stage flow, national co-funding mechanics, eligibility and templates (note: confirm the current-year edition on the call page at /Open-and-Upcoming-Calls).

View document

Chips JU Q&A / FAQWeb

Clarifies eligibility (EU Member States plus Iceland, Norway and Israel; UK excluded), co-financing rules and consortium composition questions that recur in calls.

View document

Budget split

Typical Budget Breakdown

Contribution d'Horizon Europe à l'Initiative Chips pour l'Europe50%

Contribution du programme pour une Europe numérique à l'Initiative Chips pour l'Europe50%

Calendar

2026 Deadlines

Next Cut-off16 septembre 2026

Cut-off 217 septembre 2026

Cut-off 324 septembre 2026

From submission to money

3 Feb 2026
3 Feb 20262026 ECS calls open
Two-stage global IA (40m EUR) and RIA (50m EUR) calls plus the fast-track software-defined-vehicle IA open on the EU Funding and Tenders Portal.
7 May 2026
7 May 2026Project Outline deadline (stage 1)
PO submissions for the two-stage global calls closed at 17:00 Brussels time; outlines are evaluated and successful consortia prepare full proposals.
7 Jul 2026
7 Jul 2026One-stage calls open
Resilience IA calls (power electronics, photonics, health — 20m EUR each), the 6G RIA, and the 5m EUR India/Singapore/Taiwan international RIA open for full proposals. The supply-chain and SDV ecosystem CSAs also open.
17 Sep 2026
17 Sep 2026One-stage Full Proposal deadline
Resilience IA (Focus Topics 1-3), 6G and international calls close at 17:00 Brussels time. The SDV ecosystem CSA and supply-chain CSAs close on the same date.
17 Sep 2026
17 Sep 2026Full Proposal deadline, two-stage global calls
Final submission for the global two-stage IA/RIA calls (HORIZON-JU-CHIPS-2026-1-IA/RIA); independent experts evaluate against excellence, implementation and impact.
T+5 months (~Feb 2027)
T+5 months (~Feb 2027)Evaluation results letters
Horizon Europe maximum time-to-inform standard: applicants learn the outcome within five months of the final deadline.
T+8 months (~May 2027)
T+8 months (~May 2027)Grant agreement signature
Horizon Europe time-to-grant ceiling; grant preparation, foreign-control guarantees where required, and national funding contracts with each NFA run in parallel.
GA + ~30 days
GA + ~30 daysEU pre-financing paid
The Chips JU pays the EU pre-financing shortly after the grant agreement enters into force; the national share arrives separately from your NFA on its own national schedule.

After the grant

After you're funded

Two grant agreements, not one

Winners sign the Chips JU Model Grant Agreement — published with the call documents and explicitly non-negotiable — plus separate national grants or contracts with each partner's funding authority. The JU and the national agencies try to synchronise the two processes during grant preparation, but the burden of running both in parallel sits with the consortium.

Money arrives via the coordinator

Payments follow Horizon Europe rules: prefinancing, interim payments and the final balance are all transferred to the project coordinator, who redistributes to beneficiaries under the consortium agreement — which must be concluded before the EU grant is signed. National money arrives on each country's own schedule and conditions.

Roughly 13 months from outline to signature

Evaluation results come within 5 months of the deadline (Horizon standard); the indicative grant signature is 8 months after the Full Project Proposal deadline. For a two-stage call opening in February with a May outline and September full proposal, real work funded by the EU grant typically starts well into the following year.

Horizon obligations apply in full

The no-profit rule is checked at project end, double funding from the EU budget is strictly prohibited, and beneficiary names, addresses and maximum awarded amounts are published annually on the Europa website. Expect periodic reporting and deliverables to a Chips JU project officer, with national reporting on top.

SME status gets re-checked

A self-declared SME (small or medium-sized enterprise) rating is enough to submit, but at grant preparation the organisation's LEAR (Legal Entity Appointed Representative) must complete the formal SME self-assessment. Fail it — or skip it — and your funding rate drops to the large-enterprise level.

On the ground

Practical notes

The national funding check is the make-or-break step nobody warns you about

Chips JU ECS calls are co-funded: the JU pays part and your own country's National Funding Authority pays the rest, so being scored well by Brussels is not enough — you must also be eligible under your national rules, which differ by country and can require an SME or a specific industry/academic mix in the consortium. Contact your National Funding Authority (listed in the Annual Work Programme) the moment a call opens, because national funding can be capped or tied to the EU amount, and a partner deemed nationally ineligible can sink an otherwise-fundable proposal.

Consortia form at the ECS Brokerage Event and its collaboration tool, not on the portal

The ECS R&I calls are built by the community around AENEAS, EPoSS and Inside (the three industry associations that also write the ECS-SRIA roadmap the calls are based on). Their annual ECS Brokerage Event (4-5 Feb 2026, The EGG, Brussels; roughly €300 members / €400-500 non-members) is where project ideas get pitched and consortia assembled — and even if you miss the pitch slots you can upload your idea to the ECS Collaboration Tool to find partners ahead of the call.

Two-stage calls let you test an idea cheaply before committing

The Global IA and Global RIA calls run in two phases: a short Project Outline first (deadline around early-to-mid May 2026), then the Full Project Proposal only if you pass (around 17 September 2026). Use the outline stage as a low-cost gate — it filters out weak ideas before you spend weeks on the full submission, and gives you a summer to finalise the consortium and national funding paperwork.

Your free help: NCPs for the application, Competence Centres for the substance

Each country's National Contact Point for the Chips JU (e.g. NCP Flanders) gives free guidance on call rules, eligibility and proposal navigation — use them alongside your National Funding Authority. Separately, the network of Chips Competence Centres set up under the Chips Act offers free access to technical expertise, pilot lines, design platforms, training and even investor-finding support, which can strengthen the technical credibility of a proposal.

Track record

Who's been funded

NanoIC€2.5bn total (€700m EU)

NanoIC pilot line (sub-2nm logic, imec)

Europe's largest Chips Act pilot line, at imec in Leuven, pushing sub-2nm logic with ASML and partners and giving companies open access to leading-edge nodes.

BelgiumProject

APECS-PL€96,211,548 EU contribution

Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line

A Fraunhofer-coordinated pilot line for advanced packaging and chiplet integration, building Europe's capacity in heterogeneous integration.

GermanyProject

PIXEurope€380m total (EU plus national)

European pilot line for advanced photonic integrated circuits

An ICFO-led photonics pilot line spanning eleven countries that moves integrated-photonics processes from lab to industrial adoption.

SpainProject

MOSAIC€16,013,726 EU contribution

A Mosaic of Essential Electronic Components and Systems (ECS) for Our Automated Digital Future in Industry and Mobility

An Infineon-coordinated RIA developing next-generation electronic components for automated systems across automotive, aerospace and industrial use.

GermanyProject

E2PACKMAN€22,903,223 EU contribution

European Consortium for Accelerating Innovations in Electronic Packaging Manufacturing

Sixty partners across thirteen countries, led by Infineon, advancing materials, processes and equipment for electronics packaging.

GermanyProject

At a glance

Key Features

Jusqu'à 3,3 Md€ de budget UE (1,65 Md€ Horizon Europe + 1,65 Md€ Europe numérique)

Des appels de 10 à 50 M€ chacun, couvrant la conception de puces, la photonique, le quantique, l'électronique de puissance et les compétences

Modèle cofinancé : la subvention UE/Chips JU n'est qu'une part minoritaire (~20-35 % des coûts) ; le cofinancement national de votre propre gouvernement assure le reste

Finance des lignes pilotes, une plateforme de conception et 30 centres de compétences répartis dans 28 pays

RIA aux TRL 3-4 et IA aux TRL 5-8

Fondé sur des consortiums — candidature avec des partenaires de plusieurs pays

Sources

Official links & resources

Frequently Asked Questions

Non. Le European Chips Act est la réglementation et la stratégie européennes plus larges. Le Chips JU en pilote le volet de financement — l'Initiative Chips pour l'Europe — qui finance la R&D, les lignes pilotes, une plateforme de conception de puces, les centres de compétences et les compétences, avec jusqu'à 3,3 Md€ de fonds européens (1,65 Md€ Horizon Europe + 1,65 Md€ Europe numérique).

Rarement. La plupart des appels du Chips JU exigent un consortium de partenaires issus de plusieurs pays participants. Si vous recherchez un financement non dilutif pour une seule entreprise, l'EIC Accelerator est la meilleure voie.

Le Chips JU est un partenariat cofinancé, et non une subvention Horizon classique : la contribution de l'UE/du Chips JU n'est qu'une part minoritaire des coûts du projet — environ 20 % pour une grande entreprise dans une Action d'innovation, jusqu'à environ 35 % pour une organisation à but non lucratif. À cette subvention européenne s'ajoute un cofinancement national de votre propre gouvernement, et le taux combiné varie selon le pays et le type de partenaire.

Les projets financés reçoivent à la fois une subvention du Chips JU (UE) et un cofinancement national de leur propre gouvernement. La part de l'UE n'étant que d'environ 20 à 35 % des coûts, la part nationale est essentielle pour atteindre un total viable — ce n'est pas un bonus complémentaire. Vous devez remporter l'évaluation du Chips JU ET obtenir le cofinancement national, et les budgets nationaux sont plafonnés par pays et peuvent s'épuiser, si bien qu'une proposition solide peut tout de même rester sans financement.

Les lignes pilotes (par exemple PIXEurope pour la photonique, la ligne Wide Band Gap, FAMES) sont des installations de fabrication avancée partagées où les entreprises prototypent des puces qu'elles ne pourraient pas réaliser seules. Les centres de compétences — au nombre de 30 répartis dans 28 pays — donnent aux PME et aux chercheurs un accès local à l'expertise et aux outils de conception de puces.

Les prochaines dates limites actives de 2026 sont le 7 septembre 2026 (RIA Quantum Chips Design and Enabling Technologies, ainsi que Skills Hubs et Pilot Federation) et le 17 septembre 2026 (propositions complètes ECS IA Resilience pour l'électronique de puissance, la photonique et la santé). Confirmez la date exacte sur le portail de l'UE « Funding & Tenders ».

Toutes les propositions du Chips JU sont soumises via le portail de l'UE « Funding & Tenders » sous l'identifiant d'appel HORIZON-JU-CHIPS ou DIGITAL-JU-CHIPS correspondant. Les appels en deux étapes exigent d'abord une courte esquisse, puis une proposition complète si vous êtes invité.