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This round is closed. The next round and similar open calls are listed below. Synced from the EU Funding & Tenders Portal on 9 November 2026.
This call is closed. These open or upcoming calls fund the closest work.
Projects the EU funded under this call, with the organisation that led each one.
JePPIX DETJePPIX Photonics Design Enablement Team
Led by Technische Universiteit Eindhoven · Netherlands · 2026 · Official record ↗
DreamCloudEasy access to (automotive) chip(-let) design from requirements to fully tested chips
Led by Dream Chip Technologies GmbH · Germany · 2026 · Official record ↗
IC-DASHDesign Acceleration & Services Hub
Led by Commissariat A L Energie Atomique et aux Energies Alternatives · France · 2026 · Official record ↗
Fraunhofer DETFraunhofer Design Enablement Team
Led by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV · Germany · 2026 · Official record ↗
VUO-ICValue-Driven Unified Orchestration for Integrated Circuits
Led by Tuotekehitys Oy Tamlink · Finland · 2026 · Official record ↗
EURADETEURADET – A European Advanced Design Enablement Team built on Racyics’ fully featured makeChip infrastructure
Led by Racyics GmbH · Germany · 2026 · Official record ↗
CHIPSIDEACHIPS Innovation in the Design Enablement team of Austria
Led by Silicon Austria Labs GmbH · Austria · 2026 · Official record ↗
IC-Link DETDesign Enablement Team for Europe's Next Generation Chips
Led by Interuniversitair Micro-Electronica Centrum · Belgium · 2026 · Official record ↗
Based on projects the EU funded on the same subject in this programme.
Each one links to its EU funding record and the partners it works with: a starting list for building a consortium.
Expected Outcome:The core functions of DETs include, but are not limited to:
1. Admissibility Conditions: Proposal page limit and layout
described in Appendix 6 CEI of the 2025 Work Programme of the Chips JU.
Proposal page limits and layout: described in Part B of the Application Form available in the Submission System and described in the Appendix 6 CEI of the Work Programme of the Chips JU and in the Guide for Applicants from the Call documents section.
2. Eligible Countries
described in Appendix 6 CEI of the 2025 Work Programme of the Chips JU.
3. Other Eligible Conditions
described in Appendix 6 CEI of the 2025 Work Programme of the Chips JU.
4. Financial and operational capacity and exclusion
described in Appendix 6 CEI of the 2025 Work Programme of the Chips JU.
5a. Evaluation and award: Submission and evaluation processes
described in Appendix 6 CEI of the 2025 Work Programme of the Chips JU.
5b. Evaluation and award: Award criteria, scoring and thresholds
described in Appendix 6 CEI of the 2025 Work Programme of the Chips JU.
5c. Evaluation and award: Indicative timeline for evaluation and grant agreement
Evaluation 01-12/09/2025
Grant Agreement 01/03/2026
Call documents : Set-up and integration of Design Enablement Teams
More information: Chips JU website and within Multiannual Programme 2023-2027·Chips JU
Call document and annexes:
Additional documents:
DEP Work Programmes
EU Financial Regulation 2024/2509
Rules for Legal Entity Validation, LEAR Appointment and Financial Capacity Assessment
EU Grants AGA — Annotated Model Grant Agreement 
Funding & Tenders Portal Online Manual 
Funding & Tenders Portal Terms and Conditions 
Funding & Tenders Portal Privacy Statement
Confirm the current call documents and submission conditions with the funding authority.
View on EU portal ↗Source: EU Funding & Tenders Portal · synced 2026-11-09
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